Method of producing a radiation-emitting optoelectronic component

ABSTRACT

In a method for producing a radiation-emitting optoelectronic component, a semiconductor chip is mounted by a first main area onto a carrier body and is electrically conductively connected at a first contact area to a first connection region, and a transparent electrically insulating encapsulation layer is applied to the chip and the carrier body. A first cutout in the encapsulation layer for at least partly uncovering a second contact area of the chip is produced, and a second cutout in the encapsulation layer for at least partly uncovering a second connection region of the carrier body is produced. Finally, an electrically conductive layer, which electrically conductively connects the second contact area of the semiconductor chip and the second connection region of the carrier body, is applied.

CROSS-REFERENCE TO RELATED APPLICATIONS

This patent application is a divisional application of U.S. patentapplication Ser. No. 11/654,304, filed Jan. 3, 2009 and claims thepriority of German Patent Applications 102004047680.2, filed Sep. 30,2004 and 102004050371.0, filed Oct. 15, 2004, the disclosures and entirecontents of which are hereby incorporated by reference. This is a U.S.national stage of international application No. PCT/DE2005/001603, filedon Sep. 13, 2005.

FIELD OF THE INVENTION

The invention relates to an optoelectronic component that emitsradiation in a main radiation direction, a method for producing such anoptoelectronic component and an illumination device that contains suchan optoelectronic component.

Optoelectronic components of the aforementioned type, such aslight-emitting diodes (LEDs), for example, generally have two oppositecontact areas, the first contact area often being mounted onto anelectrically conductive carrier, for example onto a region, of a chiphousing that is provided with a metallisation layer.

The electrical contact-Connection of the opposite second contact area ofa semiconductor chip usually turns put to be more difficult since itgenerally does not adjoin the carrier body's second connection regionprovided. This second contact-connection is conventionally produced bymeans of a bonding wire. In order to produce an electrically conductiveconnection between the bonding wire and the chip surface to becontact-connected, a region of the chip surface is provided with ametallic layer, the so-called bonding pad. This metal layer has thedisadvantage, however, that it is optically non-transparent and aportion of the light generated in the chip is thereby absorbed. However,a reduction of the area of the bonding pad technically possible only toa limited extent and increases the production outlay.

In order to decrease, the problem of the shading of part of the surfaceof an optoelectronic component that is provided for the coupling out ofradiation, it is known from JP 09283801 A for an electrode arranged onthe surface of the semiconductor chip to be contact-connected in awire-free manner by means of an electrically conductive transparentlayer composed of indium tin oxide (ITO). In this case, the lateralflanks of the semiconductor chip are electrically insulated from theconductive transparent layer by an insulating layer made of SiO2.

It is known from U.S. Pat. No. 6,066,861 for an optoelectronicsemiconductor chip that is contact-connected by means of a bonding wirein a conventional manner to be embedded into a potting compositioncontaining luminescence conversion substances in order to convert atleast a portion of the radiation emitted by the semiconductor chiptoward longer wavelengths. In this way, mixed-color or white light canbe generated for example with a semiconductor chip that emits blue orultraviolet light.

One object of the invention is to provide an improved optoelectroniccomponent comprising a wire-fires contact-connection in which thesemiconductor chip is protected against ambient influences, there is thepossibility for wavelength conversion of the emitted radiation, and theproduction outlay is comparatively low. Another object is to provide anadvantageous method for producing an optoelectronic component of thistype.

These and other objects are attained in accordance with one aspect ofthe invention directed to an optoelectronic component which emitsradiation in a main radiation direction, comprising a semiconductor chiphaving a first main area, a first contact area, and a second main areaopposite the first main area with a second contact area, and alsocomprising a carrier body having two connection regions electricallyinsulated from one another, the semiconductor chip being fixed by thefirst main area on the carrier body and the first contact area beingelectrically conductively connected to the first connection region, thesemiconductor chip and the carrier body are provided with a transparent,electrically insulating encapsulation layer. In this case, the radiationemitted in the main radiation direction is coupled out through theencapsulation layer. Furthermore, an electrically conductive layer isled from the second contact area over a partial region of theencapsulation layer to the second electrical connection region of thecarrier body, and electrically conductively connects the second contactarea to the second connection region.

The electrically insulating encapsulation layer advantageously fulfillsa plurality of functions. Since the encapsulation layer is electricallyinsulating, it prevents a short circuit from arising through the appliedelectrically conductive layer. This would be the case, for example, if apn junction of the semiconductor chip was short-circuited, by theapplication of the electrically conductive layer at the lateral flank ofthe semiconductor chip or the two connection regions of the carrier bodywere connected to one another by the electrically conductive layer.Furthermore, the encapsulation layer protects the semiconductor chipfrom ambient influences, in particular from dirt and moisture.

Since the radiation emitted in the main radiation direction by theoptoelectronic component is coupled out through the encapsulation layer,the encapsulation layer may advantageously also contain a luminescenceconversion material in order to generate white light for example with asemiconductor chip emitting ultraviolet or blue radiation. Suitableluminescence conversion materials, such as, for example, YAG:Ce(Y3Al5O12:Ce3+), are known from the above-mentioned U.S. Pat. No.6,066,631 A, the content of which is hereby incorporated by reference,with regard to the efficiency of the luminescence conversion it isparticularly advantageous if the encapsulation layer directly adjoinsthat surface of the semiconductor chip which is provided for thecoupling-out of radiation.

The optoelectronic component preferably contains a radiation-emittingsemiconductor chip composed of a III-V compound semiconductor material,in particular composed of a nitride compound semiconductor material.

The encapsulation layer is a plastic layer, for example. It ispreferably a silicone layer since silicone is distinguished toy a highradiation resistance, in particular toward UV light.

The encapsulation layer is particularly preferably a glass layer. Anencapsulation layer composed of a glass has the advantage that a glasshas a coefficient of thermal expansion that is generally better adaptedto the semiconductor chip than in the case of a plastic.Temperature-dictated mechanical stresses that might lead to cracks inthe encapsulation layer or even to a detachment of the encapsulationlayer are advantageously reduced as a result. A detachment of theelectrically conductive layer from the encapsulation layer caused bythermal stresses is likewise avoided. Furthermore, a glass isdistinguished by lower absorption of moisture in comparison with aplastic. Furthermore, the resistance to ultraviolet radiation is alsovery high in the case of an encapsulation layer composed of a glass.

The first main area of the semiconductor chip may simultaneously be thefirst contact area, and the semiconductor chip may foe fixed on thefirst connection region of the carrier body at said contact area. By wayof example, the first contact area of the semiconductor chip may be therear side of a substrate, which is preferably provided with ametallisation, and the electrical connection to the first connectionregion of the carrier body may be effected by means of a solderingconnection or an electrically conductive adhesive.

As an alternative, however, it is also possible for both the first andthe second contact area to be situated on the second main area of thesemiconductor chip and for both contact areas, with electricallyconductive layers insulated from one another, to be connected to arespective one of the two connection regions of the carrier body. Thisis advantageous in the case of semiconductor chips containing aninsulating substrate, for example a sapphire substrate. Insulatingsapphire substrates are often used for example in the case ofsemiconductor chips based on nitride compound semiconductors.

The electrically conductive layer is a patterned metal layer, forexample. Said metal layer is preferably patterned in such a way that itcovers only a small portion of the second main area of the semiconductorchip, in order to reduce an absorption of the radiation emitted by theoptoelectronic component in the metal layer. The patterning of the metallayer may be effected by means of photolithography, by way of example.

The electrically conductive layer is particularly preferably a layerthat is transparent to the emitted radiation. This is advantageous inparticular for reducing the production outlay, since the transparentlayer does not have to be removed from the regions of the insulatinglayer which are provided for coupling out radiation, and, consequently,no patterning is necessary. The electrically conductive layer maycontain for example a transparent conductive oxide (TCO), in particularindium tin oxide (ITO).

If a potential-free surface of the optoelectronic component isdesirable, an insulating cover layer, for example a resist layer, isadvantageously applied to the electrically conductive layer.

Another aspect of the invention is directed to a method for producing anoptoelectronic component which emits radiation in a main radiationdirection, comprising a semiconductor chip having a first main area, afirst contact area and a second main area opposite the first main areawith a second contact area, and also comprising a carrier body havingtwo connection regions electrically insulated from one another, thesemiconductor chip is mounted by the first main area onto the carrierbody, afterward a transparent insulating encapsulation layer is appliedto the semiconductor chip and the carrier body, a first cutout isproduced in the encapsulation layer for at least partly uncovering thesecond contact area of the semiconductor chip and a second cutout isproduced in the encapsulation layer for at least partly uncovering thesecond connection region of the carrier body. Afterward, an electricallyconductive layer is applied for producing an electrically conductiveconnection between the second contact area of the semiconductor chip andthe second connection region, of the carrier body.

The encapsulation layer is preferably a plastic layer. This layer may beapplied for example by laminating on a plastic film, by printing on orspraying on a polymer solution.

In a particularly preferred variant of the method according to theinvention, firstly a precursor layer is applied to the semiconductorchip and the carrier body, for example by means of a sol-gel method, byvapor deposition or by spin-coating of a suspension. The organicconstituents of the precursor layer are subsequently removed by means ofa first thermal treatment. The resultant layer is subsequently densifiedby means of a second thermal treatment in order to produce anencapsulation layer in the form of a glass layer.

The first and second cutouts in the encapsulation layer are preferablyproduced by the removal of the encapsulation layer in these regions bymeans of laser irradiation.

The electrically conductive layer is advantageously applied by a PVDmethod, for example by means of sputtering, and subsequently reinforcedby means of electrodeposition.

As an alternative, the electrically conductive layer may also be appliedby a printing method, in particular by a screen printing method.Furthermore the electrically conductive layer may also be produced by aspraying on or spin-coating method.

An optoelectronic component according to the invention is particularlyadvantageously suitable for use in illumination devices, in particularin high-power illumination devices such as headlights, for example. Inthis case, the optoelectronic component or the illumination device, inaccordance with one expedient embodiment, has a multiplicity ofsemiconductor chips. In particular, the optoelectronic component may beused in a front headlight of a motor vehicle or as a light source inprojections applications, for example in image and/or video projectors.

The illumination device advantageously has at least one optical element.Preferably, each semiconductor chip of the optoelectronic component isassigned at least one optical element. The optical element serves forforming a beam cone having a highest possible beam intensity and a leastpossible divergence.

Preferably, an optical element is assigned jointly to a plurality ofsemiconductor chips. This has the advantage, for example, of simplifiedmounting compared with the case where each semiconductor chip isassigned a dedicated optical element. In addition or as an alternative,the semiconductor chips are subdivided into at least two groups whichare each assigned a dedicated optical element. It goes without sayingthat it is also possible for each semiconductor chip to be assigned adedicated optical element. It is also possible for the component or theillumination device to have a single semiconductor chip which isassigned a single optical element.

The optical element is preferably formed in the manner of a non-imagingoptical concentrator which, compared with a customary use of aconcentrator, is provided for radiation transmission in the oppositedirection. The divergence of the light emitted by the light source canadvantageously be reduced in an efficient manner through the use of atleast one optical element of this type.

In this case, it is particularly advantageous if a light entrance of theoptical concentrator is positioned as close as possible to thesemiconductor chips, which is advantageously possible particularly wellwith the wire-free contact-connection specified since the latter,compared with a contact-connection by means of a bonding wire, can beformed with a particularly small height. The solid angle at which thelight is emitted from the optical element is expediently reduced bymeans of the optical element as close as possible to the semiconductorchips, where a cross-sectional area of the beam cone is still small.This is necessary in particular when a highest possible radiationintensity is to be projected onto a smallest possible area, as is thecase in headlight applications or projection devices.

An important conservation quantity in geometrical optics is the etendue,that is to say the light conductance. It is the product of the area of alight source and the solid angle at which is effects emission. Theentendue, describes the extent of a light cone of arbitrary intensity.The conservation of the ent endue has the consequence, inter alia, thatthe light from a diffuse radiation source, for example a semiconductorchip, can no longer be concentrated, that is to say can no longer bedeflected onto an area having a smaller extent, without acceptinglosses, for which reason it is advantageous if the light bundle entersinto the optical element with a smallest possible cross section. It isprecisely this which is made possible by the specifiedcontact-connection in a particularly advantageous manner.

In a particularly expedient embodiment, the light is greatly collimatedby means of the optical element, that is to say the divergence of thelight is greatly reduced, in such a way that it is emitted from theoptical element in a beam cone with an aperture angle which is less thanor equal to 25°, preferably less than or equal to 20°, particularlypreferably less than or equal to 15°.

The optical concentrator is advantageously a CPC-, CEC- or CHC-likeoptical concentrator, which here and hereinafter means a concentratorwhose reflective, side walls at least partly and/or at least to thegreatest possible extent have the form of a compound parabolicconcentrator (CPC), a compound elliptic concentrator (CEC) and/or acompound hyperbolic concentrator (CHC).

The reflective surfaces of the optical element are particularlyadvantageously formed partly or completely as free-form surfaces inorder to optimally set a desired emission characteristic. In terms ofits basic form, the optical element is in this case preferably similarto a CPC, a CEC or a CHC.

As an alternative, the concentrator advantageously has side walls whichconnect a radiation entrance to a radiation exit and are formed in sucha way that direct connecting lines running on the side walls between theradiation entrance and the radiation exit run essentially straight.

The optical element is advantageously formed in the manner of adielectric concentrator and has a basic body in the form of a solid bodywith a dielectric material having a suitable refractive index, so thatlight coupled into the optical element is reflected by total reflectionat lateral interfaces of the solid body with respect to the surroundingmedium. By utilizing total reflection, absorption of the light duringthe reflection thereof can be avoided to the greatest possible extent.

The optical element advantageously has a radiation exit with aninterface curved in lens-like fashion. A more extensive reduction of thedivergence of the light can be obtained as a result.

Expediently, a portion of adjacent semiconductor chips or all adjacentsemiconductors are arranged at a smallest possible, distance from oneanother. The distance is preferably less than or equal to 300 μm,particularly preferably less than or equal to 100 μm, and is greaterthan or equal to 0 μm. This measure is; advantageous for obtaining ahighest possible radiance. At the same time, in the ease ofsemiconductor chips arranged so densely, their electricalcontact-connection by means of bonding wires may be disadvantageous,whereas the wire-free contact-connection specified is particularlyadvantageous for the electrical contact-connection of chips arrangedclose together.

The invention is explained in more detail below on the basis ofexemplary embodiments in conjunction with FIGS. 1 to 8.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a schematic illustration of a cross section through a firstexemplary embodiment, of an optoelectronic component according to theinvention,

FIGS. 2A to 2F show a schematic illustration of a first exemplaryembodiment of a method according to the invention depicted asintermediate steps,

FIGS. 3A to 3C show a schematic illustration of a variant of theapplication of the encapsulation layer and/or the cover layer in asecond exemplary embodiment of a method according to the invention,depicted as intermediate steps.

FIG. 4 shows a schematic perspective illustration of a first exemplaryembodiment of the illumination device,

FIG. 5 shows a schematic perspective illustration of a second exemplaryembodiment of the illumination device,

FIG. 6 shows a schematic perspective illustration of a third exemplaryembodiment of the illumination device,

FIG. 7 shows a schematic sectional view of part of a fourth exemplaryembodiment of the illumination device,

FIG. 8 shows a schematic sectional view of part of a fifth exemplaryembodiment of the illumination device, and

FIG. 9 shows a schematic illustration of a cross section through anotherexemplary embodiment of an optoelectronic component.

Identical or identically acting elements are provided with the samereference symbols in the figures.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The first exemplary embodiment of an optoelectronic component accordingto the invention as illustrated in FIG. 1 contains a carrier body 10, towhich are applied two contact metallizations, which form, a firstconnection region 7 and a second connection region 8. A semiconductorchip 1 is mounted by a first main area 2, which simultaneouslyconstitutes the first contact area 4 in this exemplary embodiment, ontothe first connection region 7. The semiconductor chip 1 is mounted ontothe first connection region 7, for example by soldering or adhesivebonding. The semiconductor chip 1 has a second contact area 6 at asecond main area 5 of the semiconductor chip 1, said second main areabeing opposite the first main area 2.

The semiconductor chip 1 and the carrier body 10 are provided with anencapsulation layer 3. The encapsulation layer 3 is preferably a plasticlayer. In particular, a silicone layer may be involved since a siliconelayer is distinguished by a particularly good radiation resistance. Theencapsulation layer 3 is particularly preferably a glass layer.

The second contact area 6 and the second connection region 8 areconnected to one another by an electrically conductive layer 14 led overa partial region of the encapsulation layer 3. The electricallyconductive layer 14 contains for example a metal or an electricallyconductive transparent oxide (TCO), for example indium tin oxide (ITO),ZnO:Al or SnO:Sb.

In order to obtain a potential-free surface, an insulating cover layer15, for example a resist layer, is advantageously applied to theelectrically conductive layer 14. In the case of a transparentinsulating cover layer 15, the latter advantageously need not bepatterned and can therefore be applied to the optoelectronic componentover the whole area. Partial regions 16, 17 of the connection areas 7, 8are advantageously kept uncovered by the encapsulation layer 3 and thecover layer 15, so that electrical connections for the power supply ofthe optoelectronic component can be fitted in these uncovered partialregions 16, 17.

The encapsulation layer 3 protects the semiconductor chip 1 againstambient influences, in particular against dirt or moisture. Theencapsulation layer 3 furthermore functions as an insulating carrier ofthe electrically conductive layer 14, which carrier prevents a shortcircuit of the lateral flank of the semiconductor chip 1 and/or of thetwo connection areas 7 or 8 of the carrier body.

In addition, the radiation emitted in a main radiation direction 13 bythe semiconductor chip 1 is also coupled out from the optoelectroniccomponent through the encapsulation, layer 3. This has the advantagethat, a luminescence conversion material can be added to theencapsulation layer 3, said material shifting the wavelength of at leastone portion of the emitted radiation toward longer wavelengths. Inparticular, white light can be generated in this way by virtue of theradiation generated by a semiconductor chip 1 that emits in the blue orultraviolet spectral range being partly converted into the complementaryyellow spectral range. A semiconductor chip 1 comprising aradiation-generating active zone containing a nitride compoundsemiconductor material such as, for example, GaN, AlGaN, InGaN orInGaAlN is preferably used for this purpose.

An exemplary embodiment of a method according to the invention isexplained in more detail below on the basis of schematically illustratedintermediate steps with reference to FIGS. 2A to 2F.

FIG. 2A shows a carrier body 10, on which two connection regions 7, 8electrically insulated from, one another are formed, for example byapplication and patterning of a metallization layer.

In the case of the intermediate step illustrated in FIG. 2B, asemiconductor chip 1 having a first main area 2 and second main area 5is mounted by a first contact area 4, which is identical to the secondmain area 2 of the semiconductor chip 1 in this exemplary embodimentonto the first connection region 7 of the carrier body 10. Thesemiconductor chip 1 is mounted onto the carrier body 10 for example bymeans of a soldering connection or an electrically conductive adhesive.The semiconductor chip 1 has a second contact area 6 at the second mainarea 5, said second contact area being formed for example from a contactlayer or contact layer sequence which is applied to the second main area5 and is patterned by means of photolithography, for example.

FIG. 2C illustrates an intermediate step in which an encapsulation layer3 is applied to the semiconductor chip 1 and the carrier body 10provided with the connection regions 7, 8. The encapsulation layer 3 ispreferably applied by spraying on or spin-coating of a polymer solution.Furthermore, a printing method, in particular screen printing, is alsoadvantageous for the application of the encapsulation layer 3.

In the case of the method step illustrated in FIG. 2D, a first cutout11, through which a partial region of the second contact area 6 isuncovered, and a second cutout 12 through which a partial region of thesecond connection region 8 of the carrier body 10 is uncovered, areproduced in the encapsulation layer 3. The cutouts 11, 12 are preferablyproduced by laser machining. A partial region 16 of the first connectionregion 7 and a partial region 17 of the second connection region 8 areadvantageously uncovered, too, in order to enable the fitting ofelectrical connections at the carrier body 10 of the optoelectroniccomponent.

In the case of the intermediate step illustrated in FIG. 2E, the secondcontact area 6 uncovered beforehand through the cutout 11 iselectrically conductively connected, by means of an electricallyconductive layer 14, to that region of the second connection area 8 thatwas uncovered beforehand through the cutout 12.

The electrically conductive layer 14 is a metal layer, for example. Thislayer is applied for example in such a way that firstly a comparativelythin metal layer, having a thickness of approximately 100 nm, forexample, is applied to the encapsulation layer 3 over the whole area.This may be done by vapor deposition or sputtering, for example. Aphotoresist layer (not illustrated) is subsequently applied to the metallayer, in which a cutout is produced by means of phototechnology in theregion in which the electrically conductive layer 14 is intended toconnect the second contact area 6 to the second connection region 8.

In the region of the cutout in the photoresist layer, the previouslyapplied metal layer is reinforced by an electrodeposition. This isadvantageously effected in such a way that the metal layer in thegalvanically reinforced region is significantly thicker than the metallayer previously applied over the whole area. By way of example, thethickness of the metal layer in the galvanically reinforced region, maybe several (m. The photoresist layer is subsequently removed and anetching process is carried out, by means of which the metal layer iscompletely removed in the region that has not been galvanicallyreinforced. In the galvenically reinforced region, by contrast, onaccount of its greater thickness the metal layer is removed only inpart, with the result that it remains as electrically conductive layer14 in this region.

As an alternative, it is also possible for the electrically conductivelayer 14 to be applied to the encapsulation layer 3 directly inpatterned form. This may be effected for example by means of a printingmethod, in particular by means of a screen printing method.

A patterning or a patterned application of the electrically conductivelayer 14 is advantageously not required if an electrically conductivelayer 14 that is transparent to the emitted radiation is applied. Inparticular a transparent conductive oxide (TCO), preferably indium tinoxide (ITO) or alternatively an electrically conductive plastic layer issuitable as the electrically conductive transparent layer. Theelectrically conductive transparent layer is preferably applied by vapordeposition, printing on, spraying on or spin-coating.

In the case of the method step illustrated in FIG. 2F, an electricallyinsulating cover layer 15 is applied. The insulating cover layer 15 ispreferably a plastic layer, for example a resist layer. The insulatingcover layer 15 covers in particular the electrically conductive layer 14in order to produce a potential-free surface.

An alternative variant of the application of the encapsulation layer 3,that is to say of the intermediate step illustrated previously in FIG.2C, is explained below with reference to FIGS. 3A, 3B and 3C.

In this case, firstly a precursor layer 9 containing both organic andinorganic constituents is applied to the semiconductor chip 1 and thecarrier body 10.

The precursor layer is applied for example by means of a sol-gel method,by vapor deposition, sputtering, spraying on or by spin-coating of asuspension.

By means of a thermal treatment at a temperature T1 of preferablyapproximately 200° C. to 400° C. for approximately 4 h to 8 h in aneutral N2 atmosphere or under low O2 partial pressure, the organicconstituents of the precursor layer 9 are removed, as indicated by thearrows 18 in FIG. 3B.

The resultant, layer is subsequently dens if led by means of a sinteringprocess, as is illustrated schematically in FIG. 3C, in order to producethe encapsulation layer 3. The sintering is effected by means of afurther thermal treatment at a temperature T2 of preferablyapproximately 300° C. to 500° C. for approximately 4 h to 8 h. Dependingon the type of glass layer, the sintering is preferably carried outunder a reducing or oxidizing atmosphere.

The method steps described in FIGS. 3A, 3B and 3C can analogously alsobe used for producing a cover layer 15 composed of a glass. In thiscase, said method steps are preferably carried out a first time in orderto produce an encapsulation layer 3 composed of a glass, and arerepeated after the application of the electrically conductive layer 14in order to deposit a cover layer 15 made of a glass.

Through multiple repetition of the application of an electricallyinsulating layer and an electrically conductive layer, it is alsopossible to realize multilayer interconnections. This is advantageous inparticular for LED modules containing a plurality of semiconductorchips.

FIGS. 4 to 3 illustrate illumination devices comprising at least oneoptoelectronic component, which in each case have at least one opticalelement 19, each semiconductor chip 1 of the optoelectronic componentbeing assigned an optical element.

In the case of the optoelectronic component illustrated in FIG. 6, aplurality of optical elements 19 are arranged above the semiconductorchips, and are formed integrally with one another, by way of example. Bycontrast, the optoelectronic component illustrated in FIG. 4 has asingle optical element. This optical element 19 is formed in CPC-likefashion.

Each semiconductor chip 1 of the optoelectronic component is assigned toa single optical element 19, for example. A beam entrance of the opticalelements that faces the semiconductor chips has a radiation entranceopening whose sides are e.g. (1.5 times a corresponding horizontal edgelength of the semiconductor chips, preferably (1.25 times said edgelength. If such a small beam entrance is arranged as close as possibleto the semiconductor chip, a divergence of the radiation emitted by thesemiconductor chips can be effectively reduced and a beam cone having ahigh luminance can be generated.

Instead, of each semiconductor chip being assigned a single dedicatedoptical element 19, the optical element 19 may also be provided for aplurality of semiconductor chips 1, as is the case for example for theoptical element 19 of the component illustrated in FIG. 5. This opticalelement 19 is also formed in the manner of a CPC. The optical element 19is provided for six semiconductor chips 1, by way of example.

In order to achieve a highest possible efficiency, the semiconductorchips 1 should be arranged as close together as possible. At least aportion of adjacent semiconductor chips 1 are at a distance of (50 (mfrom one another, by way of example. Particularly preferably, saidsemiconductor chips are at substantially no distance from one another.

As an alternative to a CPC-like concentrator, the optical element 19 hasfor example side walls which run in straight lines from the beamentrance to the beam exit. An example of optical elements 19 of thistype is illustrated in FIG. 6. In the case of optical elements 19 ofthis type, the beam exit is preferably provided with a spherical oraspherical lens or is curved outward in the manner of such a lens.

The advantage of an aspherical curvature, compared with a sphericalcurvature, is that the aspherical curvature decreases for example as thedistance from the optical axis of the optical element 19 increases. Thistakes account of the circumstance that the beam cone whose divergence isto be reduced by means of the optical element 19 is not a point-typelight radiation source, but rather a radiation source having a certainextent.

Such an optical element having reflective walls running straight fromthe beam entrance to the beam exit has the advantage, compared with aCPC-like optical element, that it can result in a comparable reductionof the divergence of a beans cone in conjunction with a significantreduction of the structural height of the optical element 19. A furtheradvantage of such optical elements is that their straight lateral facescan be produced more simply by means of a molding method such asinjection molding or transfer molding, for example, while the formationof curved lateral faces as in the case of CPC-like concentrators iscomparatively difficult.

The optical element is preferably a dielectric concentrator with a basicbody composed of a dielectric material. As an alternative, however, theuse of a concentrator with a basic body that defines a correspondingcavity with reflective inner walls is also possible.

If the optical element 19 is formed in the manner of a dielectricconcentrator, additional fixing devices are generally necessary in orderto position the optical element 19 on or relative to the semiconductorchips.

The optical elements illustrated in FIGS. 4 and 6 have holding elements120 which extend in the vicinity of the beam exit of the optical elementand, respectively, the optical elements 19 away from the dielectricbasic body and project away laterally from the latter and also run at adistance from the basic body in the direction of the beam entrance.

The holding elements 120 may comprise pillar-like elements, for example,on which the optical elements can be set up and therefore positionedrelative to the semiconductor chips 1.

As an alternative to holding elements 120 of this type, the opticalelements 19 can also be mounted and positioned by means of separatemounting devices. By way of example, they can be inserted into aseparate frame.

The components illustrated in FIGS. 4 and 6 are optoelectronic moduleshaving a module carrier 20. There are formed on or in the module carrierelectrical conductor tracks and a mating connector 25, via which themodule can be electrically connected by means of a correspondingconnector.

In the case of the component illustrated in FIG. 7, the optical element19 is applied on the insulating cover layer 15 directly in such a waythat the beam entrance of the optical element 19 adjoins said layer. Inthis case, the cover layer 15 functions as a coupling material for theoptical element. As an alternative, the coupling material may also beapplied in the form of an additional layer on the semiconductor chip 1.A “coupling material” should be understood to mean, for example, adielectric material which is transmissive to the radiation emitted bythe semiconductor chips 1 and has a refractive index which preferablycorresponds to that of a semiconductor material of the semiconductorchips 1, with the result that Fresnel losses and total reflections atinterfaces between the semiconductor chip 1 and the optical element 19are significantly reduced.

Fresnel losses are losses owing to reflections at interfaces at whichthere is a sudden change in refractive index. A typical example is thesudden change in refractive index between air and a dielectric material.For example when electromagnetic radiation enters into or emerges froman optical element.

The semiconductor chip 1 is therefore optically coupled to thedielectric basic body of the optical element 19 by means of the couplingmaterial. The coupling material is for example a radiation-transmissivegel having a refractive index which is either adapted to the refractiveindex of their dielectric body of the optical element 19 or to therefractive index of a semiconductor material of the semiconductor chips1 or lies between the refractive indices of these two materials. As analternative to a gel, it is also possible for example to use an epoxyresin or a resist-like material.

The refractive index of the coupling material preferably lies betweenthat of the dielectric body of the optical element 19 and that of asemiconductor material of the semiconductor chips 1. What is essentialis that the refractive index is significantly greater than 1. By way ofexample, a coupling material is used for the coupling medium whoserefractive index is greater than 1.3, preferably greater than 1.4.Silicones, for example, are appropriate for this. However, othersubstances such as e.g. liquids are also possible as coupling medium.Water has, for example, a refractive index, of greater thanapproximately 1.3 and is suitable, in principle, as coupling medium.

In the case of the exemplary embodiment illustrated in FIG. 8, there isa gap 5, for example an air gap between the semiconductor chip 1 and theoptical element 19. As an alternative, the gap 5 may also be filled withsome other gas and it is likewise possible for a vacuum to prevail inthe gap 5. The gap has the effect that a highly divergent portion of theradiation emitted by the semiconductor chip 1, on account of reflectionsat the interfaces, couples into the optical element 19 to a lesserextent than a low-divergence portion. This may be advantageous for thegeneration of highly collimated beam cones and also in applications inwhich a highly divergent portion might be disturbing. One examplethereof is projection applications.

In the case of the exemplary embodiment illustrated in FIG. 7, thedistance between the beam entrance of the optical element and thesemiconductor chip 1 is less than 100 (m, e.g. only approximately 60 (m.In the case of the exemplary embodiment illustrated in FIG. 8, thedistance between the beam entrance of the optical element and thesemiconductor chip is e.g. 180 (m.

The invention is not restricted by the description on the basis of theexemplary embodiments. Moreover, the invention encompasses any newfeature and also any combination of features, which in particularcomprises any combination of features in the patent claims, even if thisfeature or this combination itself is not explicitly specified in thepatent claims or exemplary embodiments.

The invention claimed is:
 1. A method for producing an optoelectroniccomponent which emits radiation in a main radiation direction,comprising a semiconductor chip having a first main area, a firstcontact area and a second main area, opposite the first main area, witha second contact area, and a carrier body having first and secondconnection regions, electrically insulated from one another, wherein themethod comprises the steps of: mounting the semiconductor chip by thefirst main area onto the carrier body and electrically conductivelyconnecting the first contact area to the first connection region;applying a transparent electrically insulating glass encapsulation layerto the semiconductor chip and the carrier body, application of theinsulating glass encapsulation layer comprising the steps of applying aprecursor layer containing inorganic and organic constituents; removingthe organic constituents from the precursor layer with a first thermaltreatment; and densifying the precursor layer into a glass layer with asecond thermal treatment; producing a first cutout in the glass layerfor at least partly uncovering the second contact area of thesemiconductor chip, and producing a second cutout in the insulatingglass encapsulation layer for at least partly uncovering the secondconnection region of the carrier body; and applying an electricallyconductive layer, which electrically conductively connects the secondcontact area of the semiconductor chip and the second connection regionof the carrier body.
 2. A method for producing an optoelectroniccomponent which emits radiation in a main radiation direction,comprising a semiconductor chip having a first main area, a firstcontact area and a second main area, opposite the first main area, witha second contact area, and a carrier body having first and secondconnection regions, electrically insulated from one another, wherein themethod comprises the steps of: mounting the semiconductor chip by thefirst main area onto the carrier body and electrically conductivelyconnecting the first contact area to the first connection region;applying a transparent electrically insulating encapsulation layer tothe semiconductor chip and the carrier body; producing a first cutout inthe encapsulation layer for at least partly uncovering the secondcontact area of the semiconductor chip, and producing a second cutout inthe encapsulation layer for at least partly uncovering the secondconnection region of the carrier body; applying an electricallyconductive layer, which electrically conductively connects the secondcontact area of the semiconductor chip and the second connection regionof the carrier body; and applying an electrically insulating glass layerto the electrically conductive layer, application of the cover layercomprising the steps of: applying a precursor layer containing inorganicand organic constituents; removing the organic constituents from theprecursor layer with a first thermal treatment; and densifying theprecursor layer into a glass layer with a second thermal treatment. 3.The method as claimed in claim 2, wherein the encapsulation layer is aplastic layer.
 4. The method as claimed in claim 2, wherein theencapsulation layer is applied by laminating on a film, printing on,spraying on or spin-coating.
 5. The method as claimed in claim 2,wherein the encapsulation layer is a glass layer.
 6. The method asclaimed in claim 1, wherein the first cutout and the second cutout areproduced in the encapsulation layer via laser machining.
 7. The methodas claimed in claim 1, wherein in order to produce the electricallyconductive layer, a metal layer is applied by a PVD method and issubsequently reinforced via electrodeposition.
 8. The method as claimedin claim 1, wherein the electrically conductive layer is applied by aprinting method.
 9. The method as claimed in claim 1, wherein theelectrically conductive layer is applied by spraying on or spin-coating.10. The method as claimed in claim 2, wherein the first cutout and thesecond cutout are produced in the encapsulation layer via lasermachining.
 11. The method as claimed in claim 2, wherein in order toproduce the electrically conductive layer, a metal layer is applied by aPVD method and is subsequently reinforced by means of electrodeposition.12. The method as claimed in claim 2, wherein the electricallyconductive layer is applied by a printing method.
 13. The method asclaimed in claim 2, wherein the electrically conductive layer is appliedby spraying on or spin-coating.